RF60 SERIES

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OUR Products

The company has established production bases in Shandong and Guangdong, where it conducts research and development and production of current and temperature protection devices.

PRODUCT DETAILS

Dimensions (Unit: mm)



Part

Number

A

B

C

D

E

F

Style.

Max.

Max.

±0.6

Max.

Typ.

Min.

RF60-005

6.0

8.5

5.1

3.1

0.5

7.6

DZ

RF60-010

6.0

9.5

5.1

3.1

0.5

7.6

DZ

RF60-017

7.4

12.7

5.1

3.1

0.5

7.6

DZ

RF60-020

7.4

12.7

5.1

3.1

0.5

7.6

DZ

RF60-025

7.4

12.7

5.1

3.1

0.5

7.6

DZ

RF60-030

7.4

13.0

5.1

3.1

0.5

7.6

DZ

RF60-040

7.4

14.2

5.1

3.1

0.5

4.6

DI

RF60-050

7.5

14.5

5.1

3.1

0.5

4.6

DI

RF60-065

9.4

16.1

5.1

3.1

0.5

4.6

DI

RF60-075

10.2

16.8

5.1

3.1

0.5

4.6

DI

RF60-090

11.2

18.0

5.1

3.1

0.5

4.6

DI

RF60-110

 13.0

18.0

5.1

3.1

0.8

7.6

DZ

RF60-135

14.5

19.6

5.1

3.1

0.8

7.6

DZ


Part

Number

A

B

C

D

E

F

Style.

Max.

Max.

±0.6

Max.

Typ.

Min.

RF60-160

16.3

21.3

5.1

3.1

0.8

7.6

DZ

RF60-185

17.5

22.9

5.1

3.1

0.8

7.6

DZ

RF60-250

21.6

26.6

10.5

3.1

0.8

7.6

DZ

RF60-300

24.8

30.0

10.5

3.1

0.8

7.6

DZ

RF60-375

27.2

32.0

10.5

3.1

0.8

7.6

DZ


Electrical Characteristics

Part

Number

IH

IT

VMAX

IMAX

RMAX

RMIN

Pd typ.

(A)

(A)

(VDC)

(A)

(Ω)

(Ω)

(W)

RF60-005

0.05

0.10

60

40

25.0

7.50

0.30

RF60-010

0.10

0.20

60

40

7.50

2.50

0.38

RF60-017

0.17

0.34

60

40

5.80

1.80

0.48

RF60-020

0.20

0.40

60

40

3.30

1.50

0.41

RF60-025

0.25

0.50

60

40

2.20

1.00

0.45

RF60-030

0.30

0.60

60

40

1.55

0.70

0.49

RF60-040

0.40

0.80

60

40

1.10

0.50

0.56

RF60-050

0.50

1.00

60

40

0.85

0.35

0.77

RF60-065

0.65

1.30

60

40

0.65

0.30

0.88

RF60-075

0.75

1.50

60

40

0.55

0.25

0.92

RF60-090

0.90

1.80

60

40

0.45

0.20

0.99

RF60-110

1.10

2.20

60

40

0.33

0.15

1.50

RF60-135

1.35

2.70

60

40

0.27

0.12

1.70

RF60-160

1.60

3.20

60

40

0.22

0.09

1.90

RF60-185

1.85

3.70

60

40

0.18

0.08

2.10

RF60-250

2.50

5.00

60

40

0.11

0.05

2.50

RF60-300

3.00

6.00

60

40

0.09

0.04

2.80

RF60-375

3.75

7.50

60

40

0.08

0.03

3.20


·IH = Hold current: maximum current device will pass without tripping in 25℃ still air.

·IT = Trip current: minimum current at which the device will trip in 25℃ still air.

·VMAX = Maximum voltage device can withstand without damage at rated current.

·IMAX = Maximum fault current device can withstand without damage at rated voltage.

·RMAX = Maximum resistance of device in initial (un-soldered) state.

·RMIN = Minimum resistance of device in initial (un-soldered) state.

·Pd typ. = Typical power dissipation from device when in the tripped state at 25℃ still air.

 

Thermal Derating Chart – IH (A)

Part

Number

Maximum Ambient Operating Temperatures (℃)

-20

0

25

30

40

50

60

70

85

RF60-005

0.07

0.06

0.05

0.05

0.04

0.04

0.03

0.03

0.02

RF60-010

0.14

0.12

0.10

0.09

0.08

0.07

0.06

0.05

0.04

RF60-017

0.23

0.20

0.17

0.15

0.14

0.12

0.11

0.09

0.07

RF60-020

0.27

0.24

0.20

0.18

0.16

0.14

0.13

0.11

0.08

RF60-025

0.34

0.30

0.25

0.23

0.20

0.18

0.16

0.14

0.10

RF60-030

0.41

0.36

0.30

0.27

0.24

0.22

0.19

0.16

0.12

RF60-040

0.54

0.48

0.40

0.36

0.32

0.29

0.25

0.22

0.16

RF60-050

0.68

0.60

0.50

0.45

0.41

0.36

0.32

0.27

0.20

RF60-065

0.88

0.77

0.65

0.59

0.53

0.47

0.41

0.35

0.26

RF60-075

1.02

0.89

0.75

0.68

0.61

0.54

0.47

0.41

0.30

RF60-090

1.22

1.07

0.90

0.81

0.73

0.65

0.57

0.49

0.36

RF60-110

1.50

1.31

1.10

0.99

0.89

0.79

0.69

0.59

0.44

RF60-135

1.84

1.61

1.35

1.22

1.09

0.97

0.85

0.73

0.54

RF60-160

2.18

1.90

1.60

1.44

1.30

1.15

1.01

0.86

0.64

RF60-185

2.52

2.20

1.85

1.67

1.50

1.33

1.17

1.00

0.74

RF60-250

3.40

2.98

2.50

2.25

2.03

1.80

1.58

1.35

1.00

RF60-300

4.08

3.57

3.00

2.70

2.43

2.18

1.89

1.62

1.20

RF60-375

5.10

4.46

3.75

3.38

3.04

2.70

2.36

2.03

1.50


Test Procedures and Requirement

Items

Test Conditions

Accept/Reject Criteria

Resistance

In still air @25℃

Rmin ≤ R ≤ Rmax

Time to Trip

Specified current, Vmax, 25℃

T ≤ max. Time to trip (Ttrip)

Hold Current

30 min, at IH

No trip

Trip Cycle Life

Vmax, Imax, 100 cycles

No arcing or burning

Trip Endurance

Vmax, 24hours

No arcing or burning


Typical Time-to-Trip Charts @25℃



Storage Recommendations

■ Storage Temperature: -10℃~+40℃

■ Relative Humidity: ≤80%RH

■ Keep away from corrosive atmosphere and sunlight.

■ Period of Storage: 1 year.

 

Wave Soldering Recommendation Parameters



Items

Conditions

Pre-Heating Zone

Refer to the condition recommended by the flux manufacturer.

Maximum ramping rate should not exceed 4℃/sec.

Soldering Zone

Maximum solder temperature should not exceed 260℃

Cooling Zone

Forced cooling


Manual Soldering Recommendation Parameters

Items

Conditions

Soldering condition

The highest power of the manual soldering iron should be 30W or less, soldering temperature should not be higher than 280℃.

Soldering time

The soldering time should be kept within 3 seconds, otherwise it might cause insulation layer cracking, and increased part resistance.

Soldering position

The distance on the leads between the soldering point and bottom of the PPTC body should be equal or greater than 4mm.

Other

The soldering iron should not contact the PPTC body except the leads. If the soldering conditions are kept to lower temperature, less time and larger distance, the outcome of the soldering will be better.

Notes: 1. Before using the device must be stored in the original bags, if the storage conditions do not guarantee,

the device may not be able to meet the given value.

        2. The devices can’t used for reflow soldering.

 

Mechanical Characteristics

Items

Specifications

Test Conditions/Methods

Tensile strength

No visible damage

1.0Kgf, 10 seconds

Bending strength

No visible damage

0.5Kgf, 90°, 3 times

Vibration

No visible damage

Freq: 10-55Hz, Amp: 0.75mm, 1min

 

Reliability Test

Items

Specifications

Test Conditions/Methods

Solder ability

No visible damage,Solder OK,

Solder area ≥95%

245±5℃, 2±1s, dipping depth=0.5inch max from the body

Resistance to

soldering heat

No visible damage,

Electrical OK, │△R/R0│≦50%

260±5℃, 10+2/-0s

Damp heat,

steady state

No visible damage, Electrical OK,

│△R/R0│≦20%

40±2℃, 90~95 % RH, total 48Hrs, after 4Hrs test electrical parameter

Temperature

cycling

No visible damage, Electrical OK,

│△R/R0│≦20%

Ta=-10+0/-1℃ 30min, Ta=70+1/-0℃ 30min, 5cycles, after 1hr test electrical parameter


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